SMT Soldering Defects: Identifying the Causes and Preventing Them Systematically
A stable SMT process is the result of many carefully coordinated factors. Solder paste, stencil design, PCB condition, components, printing parameters, and the reflow profile all need to work together as one system. When defects such as voiding, solder balling, poor wetting, or tombstoning occur, the solder paste is often the first suspected cause. In […]
