SMT Soldering Defects: Identifying the Causes and Preventing Them Systematically
A stable SMT process is the result of many carefully coordinated factors. Solder paste, stencil design, PCB condition, components, printing parameters, and the reflow profile all need to work together as one system. When defects such as voiding, solder balling, poor wetting, or tombstoning occur, the solder paste is often the first suspected cause. In […]
Choosing the Right Solder Paste – 7 Key Factors for a Stable SMT Process
Selecting a solder paste is often reduced to two basic criteria: alloy and powder size. In practice, however, these factors alone are not enough to ensure a stable and reliable SMT process. Solder paste is a sophisticated system consisting of metal powder and flux. Its performance must be matched to the specific requirements of the […]
