New CLP Classification of Silver: What Does It Mean for SAC305 and Solder Pastes?
The new CLP classification of silver has changed the regulatory assessment of elemental silver in the European Union since May 1, 2026. For the electronics manufacturing industry, this raises an important question: what does the new classification mean for SAC305, solder pastes, solder bars, pellets, and other silver-containing solder alloys? Silver has been one of […]
Solder Materials from Europe – Why Regional Supply Chains Are Becoming a Competitive Advantage
For many years, reliable material availability was largely taken for granted. Raw materials were sourced globally, transportation routes were optimized, and inventory levels were reduced. Price, quality, and lean inventories were often the primary considerations. Recent years, however, have demonstrated how vulnerable global supply chains can be to geopolitical conflicts, raw material shortages, transportation disruptions, […]
How to Store and Prepare Solder Paste Correctly – 8 Rules for a Stable SMT Process
High-quality solder paste is a precisely balanced system of metal powder and flux. However, formulation alone does not determine how reliably it will perform in an SMT process. Storage, temperature conditioning, and handling before use can also have a significant influence on processing characteristics. A solder paste manufactured and tested under controlled conditions can be […]
VOC-Free Wave Soldering – Can Water-Based Fluxes Replace Alcohol-Based Systems?
Wave soldering has been an established process in electronics manufacturing for decades. At the same time, the requirements placed on the fluxes used in this process are changing. In addition to wetting performance, process stability, and residue behavior, other factors are becoming increasingly important: VOC emissions, occupational safety, fire protection, storage requirements, and sustainability. As […]
SMT Soldering Defects: Identifying the Causes and Preventing Them Systematically
A stable SMT process is the result of many carefully coordinated factors. Solder paste, stencil design, PCB condition, components, printing parameters, and the reflow profile all need to work together as one system. When defects such as voiding, solder balling, poor wetting, or tombstoning occur, the solder paste is often the first suspected cause. In […]
Recycled Metals in Solder Pastes – Sustainability Without Compromising Quality and Reliability
Sustainability is becoming increasingly important in electronics manufacturing. Companies are no longer focusing solely on the energy consumption of their production processes. Raw materials, supply chains, material origins, and the use of secondary resources are also becoming increasingly relevant. This is particularly important for solder pastes. A significant proportion of solder paste consists of metal […]
