Recycled Metals in Solder Pastes – Sustainability Without Compromising Quality and Reliability

Recycelte Metalle für Lotpasten in der Elektronikfertigung

Sustainability is becoming increasingly important in electronics manufacturing. Companies are no longer focusing solely on the energy consumption of their production processes. Raw materials, supply chains, material origins, and the use of secondary resources are also becoming increasingly relevant. This is particularly important for solder pastes. A significant proportion of solder paste consists of metal […]

Choosing the Right Solder Paste – 7 Key Factors for a Stable SMT Process

Auftragen von Lötpaste im SMT-Schablonendruck

Selecting a solder paste is often reduced to two basic criteria: alloy and powder size. In practice, however, these factors alone are not enough to ensure a stable and reliable SMT process. Solder paste is a sophisticated system consisting of metal powder and flux. Its performance must be matched to the specific requirements of the […]

Rising Silver Prices: New Momentum for Your Alloy Strategy

Graphical representation of the rising silver price from March to February, with a peak increase of over 200 percent.

Rising silver prices are creating significant market movement and forcing companies to make new strategic decisions. Our application engineers are also closely engaged with these developments. In recent weeks, the focus of many customer discussions has shifted. While topics such as process windows, print stability, or profile optimization typically dominate conversations, one central question is […]

SolderBonds Solder Preforms for Controlled Solder Volume Increase

In modern SMT manufacturing, available solder volume is increasingly limited by fine-pitch designs, reduced stencil thickness, and higher component density. At the same time, reliability requirements continue to increase, especially in applications exposed to mechanical shock, vibration, or thermal cycling. SolderBonds solder preforms provide a controlled and repeatable method to increase solder volume without modifying […]

Non-Newtonian Behavior of Solder Paste: Physics and Practice

Solder paste is a classic example of a non-Newtonian fluid with thixotropic behavior and a pronounced so-called yield stress. What does this mean in practical terms? At rest, solder paste exhibits a high internal structural strength.This ensures that the paste remains stable, does not slump, and retains its shape once it has been printed.Only when […]