Rising Silver Prices: New Momentum for Your Alloy Strategy
Rising silver prices are creating significant market movement and forcing companies to make new strategic decisions. Our application engineers are also closely engaged with these developments. In recent weeks, the focus of many customer discussions has shifted. While topics such as process windows, print stability, or profile optimization typically dominate conversations, one central question is […]
SolderBonds Solder Preforms for Controlled Solder Volume Increase
In modern SMT manufacturing, available solder volume is increasingly limited by fine-pitch designs, reduced stencil thickness, and higher component density. At the same time, reliability requirements continue to increase, especially in applications exposed to mechanical shock, vibration, or thermal cycling. SolderBonds solder preforms provide a controlled and repeatable method to increase solder volume without modifying […]
Raw Materials of a Solder Paste – Materials Science Fundamentals and Their Impact on Process Performance
Raw Materials of Solder Paste play a decisive role in SMT process performance. The quality and precise balance of these materials determine printability, wetting behavior, voiding control, and long-term reliability. A solder paste is not just a simple mixture of metal powder and flux. Instead, it is a highly engineered system optimized through materials science. […]
Non-Newtonian Behavior of Solder Paste: Physics and Practice
Solder paste is a classic example of a non-Newtonian fluid with thixotropic behavior and a pronounced so-called yield stress. What does this mean in practical terms? At rest, solder paste exhibits a high internal structural strength.This ensures that the paste remains stable, does not slump, and retains its shape once it has been printed.Only when […]
