What we bond, we uphold – with technical precision, ecological responsibility, and strong partnerships.
With SolderBonds, SOLDER CHEMISTRY introduces a new generation of solder preforms specifically developed to enhance modern SMT and reflow processes.
SolderBonds combine precise dosing, reliable handling, and outstanding solder joint quality – especially in applications requiring high thermal or mechanical performance.
SolderBonds are used in combination with solder paste to increase the overall solder volume while significantly reducing voiding within the joint.
The additional solder mass creates a more robust mechanical connection, improving both thermal conductivity and long-term reliability under thermal cycling.
Since SolderBonds are made from the same alloy as the solder paste used in production, both materials melt synchronously during reflow.
The flux contained in the paste fully activates the soldering process — no additional activators, extra process steps, or special equipment are required.
This ensures a clean, efficient, and fully reproducible manufacturing environment.
SolderBonds can be integrated into existing SMT lines without any process changes.
They are supplied in tape-and-reel format and can be placed using standard pick-and-place systems just like conventional components.
This makes them ideal for high-volume production as well as prototyping and high-reliability applications.
Typical fields of application include:
Power electronics and high-current assemblies
Thermally stressed components (power devices, sensors, LEDs)
Assemblies with increased mechanical load (automotive, aerospace, industrial control)
Increased solder volume for more robust connections
Reduced voiding through optimized joint filling
Synchronous melting behavior with solder paste
No process modifications required – fully compatible with existing SMT lines
Standard tape-and-reel packaging for automated handling
Improved thermal conductivity and enhanced mechanical strength
With SolderBonds, SOLDER CHEMISTRY provides an innovative solution to push the boundaries of conventional solder joint performance — offering more stability, fewer voids, and higher reliability.
For individual application support or material recommendations, you can submit your technical data directly to us via the contact form.
Do you have questions, need technical support, or want to talk to us directly?
We are personally there for you – quickly, reliably, and on equal terms.
