What we bond, we uphold – with technical precision, ecological responsibility, and strong partnerships.
SOLDER CHEMISTRY solder pastes combine advanced material technology with practical process expertise. They offer exceptional stability during stencil printing, excellent wetting behavior, and consistent solder joint quality – even under demanding conditions such as fine-pitch components, high component densities, or extended open times in the printing process.
Our formulations are designed for maximum process reliability and reproducibility. Whether lead-free, leaded, or customized to specific requirements – every paste is developed according to clearly defined rheological, chemical, and thermal criteria to ensure optimal performance in reflow, vapor-phase, or vacuum soldering processes.
By using halogen-free flux systems and ultra-high-purity metal powders, our products meet the requirements of modern electronics manufacturing – from automotive and medical technology to high-reliability sectors and industrial applications.
SC BLF09 stands for maximum reliability in modern SMT production.
This halogen-free, no-clean solder paste has been specifically developed for reflow processes in air atmosphere – nitrogen is not required, except for extremely fine-pitch applications.
Its innovative flux technology ensures excellent print transfer, minimal voiding, and consistent wetting performance, even after extended production pauses.
With high oxidation resistance and outstanding electrical reliability, SC BLF09 delivers clean, shiny, and reproducible solder joints throughout the entire manufacturing process.
Whether in automotive, industrial, or medical electronics, SC BLF09 is the ideal choice for manufacturers who demand process robustness, stability, and cost efficiency.
Every SMT line is unique – and choosing the right solder paste along with the appropriate process parameters is crucial for efficiency and quality.
Use the form below to share key technical details of your application with us – for example the type of process, component dimensions, or special requirements.
Based on this information, we provide targeted support in selecting the most suitable solder paste and offer recommendations for ideal profile and process parameters.
All information is, of course, voluntary. We are also happy to assist you with a technical consultation even without a completed form.
You may additionally upload files such as reflow profiles or images of solder joints and components to make your inquiry even more precise.
Do you have questions, need technical support, or want to talk to us directly?
We are personally there for you – quickly, reliably, and on equal terms.
