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SOLDER CHEMISTRY are an integral part of modern electronics manufacturing, ensuring process stability, repeatability, and surface cleanliness throughout all stages of assembly.
They complement our solder materials exactly where precise cleaning, rework, or component fixation is essential for achieving the highest product quality.
Our product range includes cleaning agents, rework fluxes, adhesives, and auxiliary materials for stencil and screen cleaning. Each product is designed with practical manufacturing needs in mind, ensuring efficient, safe, and reproducible processes.
Our specially formulated cleaning agents and stencil cleaners provide residue-free printing surfaces, stable paste release, and extended stencil lifetimes.
SOLDER CHEMISTRY cleaning agents offer controlled evaporation, high particle solubility, and gentle material compatibility.
For manual applications, we provide pre-saturated cleaning wipes that ensure uniform, lint-free cleaning results.
Our rework fluxes are engineered specifically for touch-up soldering and repair operations.
They provide clean reactivation of oxidized surfaces, excellent wetting properties, and minimized residues in both manual and semi-automated processes.
To ensure secure component positioning during placement and soldering, we offer SMT adhesives with defined viscosity, controlled curing behavior, and excellent adhesion to PCB surfaces.
Our adhesives feature high stand-off stability, short curing times, and compatibility with reflow and vapor-phase processes — ideal for double-sided assembly or mechanical reinforcement of components.
All SOLDER CHEMISTRY auxiliary materials are designed to work seamlessly together, supporting stable, clean, and efficient production — from stencil printing to soldering, cleaning, and rework.
Using the form below, you can share your technical requirements with us — such as printing method, type of cleaning, desired adhesive properties, or rework applications.
SOLDER CHEMISTRY Rework Flux 09 is specifically developed to support reliable, clean, and robust rework and repair operations on modern SMT assemblies.
Optimized for use with the BLF09 and BLF8915 solder paste series, it ensures identical wetting and flow behavior to the original production process.
The carefully balanced formulation enables fast activation of oxidized surfaces, excellent wetting performance, and minimal residues after soldering.
Thanks to its chemical compatibility with the flux systems used in the BLF series, Rework Flux 09 can be applied without risk of residue reactions, visual changes, or corrosion.
Do you have questions, need technical support, or want to talk to us directly?
We are personally there for you – quickly, reliably, and on equal terms.
