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Lead free solder pastes

Based on our classic range, these pastes are the leading edge product for the lead-free age.

 

Solder paste SOLDER CHEMISTRY BLF01

TYPE ISO 1.2.3.C; J-STD-004 RE LO

Guaranteed no solder or side balls. The ultimate solution for pin-in-paste processes without solder or flux splatter.

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Solder paste SOLDER CHEMISTRY BLF02

TYPE ISO 1.2.2.C

The lead free paste for excellent results on Ag-, AgPd-, Cu and brass surfaces.

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Solder paste SOLDER CHEMISTRY BLF03

TYPE ISO 1.2.3.C

No clean and 100% halogen free. The residues protect the printed circuit board as good as conformal coating.

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Solder paste SOLDER CHEMISTRY BLF04

TYPE ISO 1.2.2.C; J-STD-004 RE LO

Very good no clean solder paste. Highly appreciated in Automotive due to low residues with extremely high SIR values and void-free solder joints.

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Solder paste SOLDER CHEMISTRY BLF041

Type ISO 1.2.3.C; J-STD-004 RE L0

The evolution of BLF04 for excellent, absolutely void-free solder joints with water-clear residues, which can be easily removed, if necessary.

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Solder paste SOLDER CHEMISTRY BLF05

TYPE ISO 1.2.3.C

Leaves almost no and barely noticeable residues and makes bonding near the soldering joint possible. Absolutely no solder or flux splatter.

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Solder paste SOLDER CHEMISTRY BLF061

Water Soluble, TYPE ISO 1.2.3.C

SC BLF061 is our water-soluble lead-free paste.

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Solder paste SOLDER CHEMISTRY BLF08

TYPE ISO 1.2.2.C

Guaranteed void-free solder joints.

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Solder paste SOLDER CHEMISTRY BLF081

TYPE ISO 1.2.2.C

The universal solution in lead-free soldering.

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Solder paste SOLDER CHEMISTRY BLF083

TYPE ISO 1.2.3.C

Our top product. Designed for excellent soldering results under all conceivable conditions. No voids, no solder balls and an extremely long bonding time.

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Indium Advanced Materials GmbH
Fragnerstraße 4
D-84034 Landshut, Germany

Tel. +49 (0) 871 / 430950-0
E-Mail info[AT]solderchemistry.com

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© Indium Advanced Materials GmbH 2024