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Lead containing solder pastes

Our no clean solder pastes are the result of many years of experience in the SMT field. Together with the careful and strict observance of DIN, SC, IPC and MIL standards they are excellently adapted to their respective applications.

 

Solder paste SOLDER CHEMISTRY SC 111

Water washable ISO 1.2.3.C

Unique, water-soluble paste. The residues after soldering can be completely removed only with water, no detergent needed.

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Solder paste SOLDER CHEMISTRY SC 126

TYPE ISO 1.2.2.C

Our in general used paste, developed over many years. Provides excellent results on Ag, Cu, AgPd and bass surfaces.

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Solder paste SOLDER CHEMISTRY SC 127

TYPE ISO 1.2.2.C

Excellent void-free solder joints paired with minimal, clear residues. These can be easily removed if necessary.

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Solder paste SOLDER CHEMISTRY SC 150

TYPE ISO 1.2.3.C

Leaves almost no and barely noticeable residues making bonding near the soldering joint possible. Absolutely no solder or flux splatter.

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Solder paste SOLDER CHEMISTRY SC 170

TYPE ISO 1.2.3.C

"No Clean" - solder paste. The residues after soldering protect the printed circuit board as good as conformal coating. Highly regarded in automotive, aviation and aerospace industries.

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Solder paste SOLDER CHEMISTRY SC 181

TYPE ISO 1.2.3.C

More than excellent soldering results without solder or side balls. Proven also for pin-in-paste solutions.

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©Solder Chemistry 2017

© Solder Chemistry 2018