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FAQs

Lexicon of soldering

Technical terms - easy and understandable explanations on the point.

 

2D

two-dimensional, e.g. at a solder paste inspection.

 

3D

Three-dimensional, e.g. at a solder joint inspection.

 

Activity

Summary of chemical compounds for the manufacture of wetting.

 

Bounce

Distance between top of head plate and bottom of template that must be bridged by the squeegee pressure.

 

Caliper profile

Temperature profile in which the entire circuit board on a temperature is brought before it reaches the melting point of the solder.

 

Contactpressure

The template is parallel to the circuit board.

 

Convection

Reflow process in which energy is transmitted by gas or air.

 

Coolingzone

Zone in the reflow oven to cool down the assembly after remelting the solder.

 

Cutting speed

Time value between the removal of the template from the conductor plate surface and reaching the highest point over the paste depot (in relation to the bottom of template).

 

Dispenser

Automatic Solder paste conveyors.
A: for the solder paste feed on the Schablone
B: to bring individual dots on the printed circuit board
C: to perform Solderpastelineprints (to solder up E.g. HF-frame)

 

Downstop

Maximum path, the template may push the squeegee.

 

Finepitch

Starts with a grid of 0.5 mm.

 

Floods

Process in which the product prior to printing on the screen is extensively distributed. Is used in the printing process.

 

Grid

See Pitchdistance.

 

Head plate parameters

Parameters according to which a PCB is specified.

 

Knead

Accelerated  pressure several times performed to soften the solder paste.

 

Peak

Temperature curve above the melting area of the bid. Should be as short as possible.

 

Pitchdistance

Distance from the center of pads to the middle of the next pad.

 

Pressure cycle

Entire process for printing on a printed circuit board.

 

Printed circuit board

Base plate of an electronic assembly that provides the electrical connection between the individual components by metal inserts.

 

Printer

Device to apply the paste or adhesive on the printed circuit board.

 

Printing speed

Speed of the doctor blade in the printing process (pastes should be at older RMA 20-45 mm / s, 60-200 mm / s with newer no clean pastes).

 

Proflow©

Closed squeegee head of company DEK ©.

 

PuckPack

Closed squeegee head characteristic of the consumption of small quantities of paste in the functional area (gap between the squeegee lips).

 

Reflow

Process in which the solder paste is melted and thus establishes the metallic connection.

 

Residues

Organic residue that remains after soldering on the PCB.

 

Rheopump Printhead©

Closed squeegee head of the company MPM ©.

 

Screen printing

A coated screen is used instead of a template. Procedure for the application of, for example, solder stop paint.

 

Sideball

Solder bead, resulting from passive 2-pin components on the non-metallic side, after the soldering process.

 

SMEMA interface

Electrical interface for communication between the individual devices of a production line.

 

Snap off

See bounce.

 

Solder

Metal for the production of the electrical connection between the component and circuit board.

 

Solder balling

Solder particles, which, due to their oxide content, doesn’t merge with the nut slot and remains as small beads of solder on the printed circuit board.

 

Solder paste

Mixture of powdered solder and flux.

 

Solder stop paint

Finish on the circuit board to avoid solder bridges and as an insulator of overhead lines.

 

Speed of operation

Speed with which the template is separated from the PCB after the printing process.

 

Squeegee

Part of the printer, which pushes the solder paste through a sliding operation through the stencil openings.

 

Squeegee hardness

Indication of the hardness of the material when plastic squeegees.

 

Squeegee pressure

Pressure applied on the blade.

 

Squeegee way

The way the squeegee covers in the printing process. He must lead over the entire surface of the layout, but not more than it's necessary.

 

Tackyness

Adhesive ability of solder paste.

 

Temperature profile

Temperature gradient in the reflow process.

 

Template, blasphemed

Metal template, which was produced with the help of a laser. The curing process depends on the quality.

 

Template cleaner

Medium to clean the stencil. A distinction is made between the final cleaning and cleaning during the printing process.

 

Template, etched

Metal template, which is made during the chem. etching process. Suitable for standard applications (>0.5 pitch).

 

Template openings

Holes in the stencil, solder paste is pressed through.

 

Template printing

Method of applying solder paste.

 

Template thickness

Thickness of stencil, responsible for the height of the printed solder paste. Is selected according to the printed layout.

 

Template, Zinc built

Nickel mask, which is produced in the electroplating process of construction. Suitable for very thin stencils. High costs, best acutance.


 

Vapor phase soldering process

The heat supply to the soldering points on the PCB is made by the phase transformation (duty of the accumulated stream heat), on the relatively cool surface of PCB, solder paste and components of the saturated stream to liquid of high boiling medium.

 

Wet film thickness

Thickness of printed solder paste, depending on the strength of stencil, squeegee pressure, solder paste.

 

Wetting

Shipping binding capacity of the bid due to flux.

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©Solder Chemistry 2017

© Solder Chemistry 2018