Technical terms - easy and understandable explanations on the point.
two-dimensional, e.g. at a solder paste inspection.
Three-dimensional, e.g. at a solder joint inspection.
Summary of chemical compounds for the manufacture of wetting.
Distance between top of head plate and bottom of template that must be bridged by the squeegee pressure.
Temperature profile in which the entire circuit board on a temperature is brought before it reaches the melting point of the solder.
The template is parallel to the circuit board.
Reflow process in which energy is transmitted by gas or air.
Zone in the reflow oven to cool down the assembly after remelting the solder.
Time value between the removal of the template from the conductor plate surface and reaching the highest point over the paste depot (in relation to the bottom of template).
Automatic Solder paste conveyors. A: for the solder paste feed on the Schablone B: to bring individual dots on the printed circuit board C: to perform Solderpastelineprints (to solder up E.g. HF-frame)
Maximum path, the template may push the squeegee.
Starts with a grid of 0.5 mm.
Process in which the product prior to printing on the screen is extensively distributed. Is used in the printing process.
Head plate parameters
Parameters according to which a PCB is specified.
Accelerated pressure several times performed to soften the solder paste.
Temperature curve above the melting area of the bid. Should be as short as possible.
Distance from the center of pads to the middle of the next pad.
Entire process for printing on a printed circuit board.
Printed circuit board
Base plate of an electronic assembly that provides the electrical connection between the individual components by metal inserts.
Device to apply the paste or adhesive on the printed circuit board.
Speed of the doctor blade in the printing process (pastes should be at older RMA 20-45 mm / s, 60-200 mm / s with newer no clean pastes).
A coated screen is used instead of a template. Procedure for the application of, for example, solder stop paint.
Solder bead, resulting from passive 2-pin components on the non-metallic side, after the soldering process.
Electrical interface for communication between the individual devices of a production line.
Metal for the production of the electrical connection between the component and circuit board.
Solder particles, which, due to their oxide content, doesn’t merge with the nut slot and remains as small beads of solder on the printed circuit board.
Mixture of powdered solder and flux.
Solder stop paint
Finish on the circuit board to avoid solder bridges and as an insulator of overhead lines.
Speed of operation
Speed with which the template is separated from the PCB after the printing process.
Part of the printer, which pushes the solder paste through a sliding operation through the stencil openings.
Indication of the hardness of the material when plastic squeegees.
Pressure applied on the blade.
The way the squeegee covers in the printing process. He must lead over the entire surface of the layout, but not more than it's necessary.
Adhesive ability of solder paste.
Temperature gradient in the reflow process.
Metal template, which was produced with the help of a laser. The curing process depends on the quality.
Medium to clean the stencil. A distinction is made between the final cleaning and cleaning during the printing process.
Metal template, which is made during the chem. etching process. Suitable for standard applications (>0.5 pitch).
Holes in the stencil, solder paste is pressed through.
Method of applying solder paste.
Thickness of stencil, responsible for the height of the printed solder paste. Is selected according to the printed layout.
Template, Zinc built
Nickel mask, which is produced in the electroplating process of construction. Suitable for very thin stencils. High costs, best acutance.
Vapor phase soldering process
The heat supply to the soldering points on the PCB is made by the phase transformation (duty of the accumulated stream heat), on the relatively cool surface of PCB, solder paste and components of the saturated stream to liquid of high boiling medium.
Wet film thickness
Thickness of printed solder paste, depending on the strength of stencil, squeegee pressure, solder paste.