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Terms of use
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The lead free solder pastes SOLDER CHEMISTRY BLF are high tech products designed
for the new generation of SMD technology. Many years of experience in the SMT field and
well-funded knowledge in polymers chemistry were part of a complete development for the
future.
These SMT solder pastes are a homogeneous mixture of solder
powder, in all required alloys and grain sizes, and an organic flux based on synthetic rosin.
Absolutely halogen free does not only mean the solder pastes are lead free after the
reflow, but already free of all halogens in the solder pastes itself.
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Product
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Specific feature
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Solder paste SOLDER CHEMISTRY BLF01
ISO 1.2.3.C; J-STD-004 RE L0
lead free
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The solder paste SC BLF01 distinguishes itself through an excellent slump not only at room
temperature, but also in the pre-heat phase, and therefore has excellent qualifications for
Fine Pitch - applications.
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Solder paste SOLDER CHEMISTRY BLF02
Type ISO 1.2.2.C ; J-STD-004 RE L1
lead free
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The solder paste SOLDER CHEMISTRY BLF 02 is a high tech product, which is very
well applicable in all so called lead free SMT applications. It distinguish itself
with outstanding slump, no making of solder balls or splashes, a long term
processing time and long standing time, as well as a high temperature stability.
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Solder paste SOLDER CHEMISTRY BLF03
Type ISO 1.2.3.C RE L0
lead free
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The SC BLF03 is a cosequently evolved High-Tech-Product, which is best suitable for all
lead-free SMT applications.
The SC BLF03 is a homogenous mixture of a lead-free solder powder available in all
required alloys and grain sizes, with an organic flux based on synthetic resin
corresponding to RE L0 according to J-STD 004 (F-SW32) (exceeds the expectations of
RMA!). Thus it belongs to the latest "no-clean" solder paste types.
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Solder paste SOLDER CHEMISTRY BLF04
Type ISO 1.2.2.C ; J-STD-004 RE L1
lead free
New!
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The solder paste SOLDER CHEMISTRY BLF 04 our latest product, was developed especially for all so called
lead free SMT applications. Though thanks to the application of modern chemical substances like plastics
and resins, activator systems etc. all our pastes till now are able to be combined together with lead free
alloys, the latest perceptions in "lead free soldering" have cotributed to this new development. Of course
the careful and severe consideration of the norms DIN, EN,
IPC and MIL are part of this product, too.
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Solder paste SOLDER CHEMISTRY BLF05
Type ISO 1.2.3.C RE L0
lead free
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The solder paste SOLDER CHEMISTRY SC BLF05 is one of the latest, promising
creations specifically suitable for soldering in vapor phase and under inert gas. Not only
many years of experience in the SMT field and a lasting cooperation with users of vapor
phase ovens, but also the careful and strict consideration of ISO-, EN-, IPC-,and MIL-
standards were part of a complete development for the future.
SC BLF05 is a homogeneous mixture of solder powder, in all required alloys and grain
sizes, and an organic flux based on synthetic rosin, corresponding to RE L0 according
to J-STD-004, being thus one of the very best "vapor phase" solder pastes.
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Solder paste SOLDER CHEMISTRY BLF06
Water Soluble, Type ISO 1.2.3.C RE L0
lead free
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The solder paste SOLDER CHEMISTRY SC BLF06 was already in devolopement pointed
onto lead free applications, what distinguishes this high-tech SMT-product. The flux is,
too, before well as after the soldering very easy removeable. Its development is founded
on the high demands of customers on the field of hybrid circuits and the SMT especially in
the areaof HF, as well as the strict and severe consideration of ISO-, EN-, IPC- and MIL-norms.
The SC BLF06 is a homogenous mixture of solder powder, available in all requiered alloys
and grain sizes, with an organic flux based on watersoluable rosin according to class RE
L0 according to J-STD-004. It is halide-free and belongs to the best water washable solder
paste types.
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